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Selecting the right acoustic vent for an electronic device requires a balance between the level of protection the vent supplies, and what the vent contributes to the overall sound performance of the acoustic system.

Examines the constraints that may have an impact on cable performance, and the process involved in selecting the right materials based on sufficient testing to verify cables will survive in harsh environments.

The challenge of designing electronic devices that stay protected from dust, liquids and pressure becomes increasingly difficult when acoustics are introduced.

Listed below are global distributors authorized to supply bulk wires and cables manufactured by W. L. Gore & Associates. We offer an extensive portfolio of proven trustworthy products that has served many industries since the 1950s — including defense air and land, spaceflight, civil air, semiconductor and microelectronics and more.

选择防水防尘透气产品时，先确定应用、设备或外壳所需的防护等级非常关键。

由于NEMA需要进行IP中不包含的额外测试，因此IP防护等级无法“转换”为NEMA等级。但是，NEMA防护等级可满足或超出特定IP代码的要求。

GORE®压力平衡透气产品可通过平衡压力来延长产品寿命

スクリューインシリーズは機械的ストレスと厳しい環境への耐久性を備えた、さまざまな性能オプションを提供しています。すべての製品が撥油性メンブレンを使用しており、加水分解耐性、紫外線耐性、耐熱性を実現します。機械的衝撃耐性に対する最高の「IK10」等級に新たに対応し、耐衝撃性を向上したゴア® ポリベント ステンレススチールを含め、すべてのポリベント製品を比較してみてください。ゴア® ポリベント ステンレススチールにより、容積20リットル以下の筐体は最も厳しい機械条件と環境条件への耐性を実現できます。

* IK10等級が適用されるのはゴア® ベントです。機器ではありません。

The current methods used by manufacturers to protect MEMS microphones can cause performance degradation, significant yield losses and higher manufacturing costs. With GORE^® MEMS Protective Vent Style 200, industry-leading protection and acoustic performance can be installed without any special handling during circuit board assembly.

The current methods used during circuit board assembly to protect MEMS microphones can cause performance degradation, significant yield losses and higher manufacturing costs. With GORE MEMS Protective Vent Style 100, industry-leading protection and acoustic performance can be seamlessly installed during circuit board assembly.

Style 200 can be installed inside the MEMS microphone during the microphone packaging process.